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 MOTOROLA
SEMICONDUCTOR TECHNICAL DATA
Product Preview
MC54/74HC175A
J SUFFIX CERAMIC PACKAGE CASE 620-10
1
Quad D Flip-Flop with Common Clock and Reset
High-Performance Silicon-Gate CMOS
The MC54/74HC175A is identical in pinout to the LS175. The device inputs are compatible with standard CMOS outputs; with pullup resistors, they are compatible with LSTTL outputs. This device consists of four D flip-flops with common Reset and Clock inputs, and separate D inputs. Reset (active-low) is asynchronous and occurs when a low level is applied to the Reset input. Information at a D input is transferred to the corresponding Q output on the next positive going edge of the Clock input. * * * * * * Output Drive Capability: 10 LSTTL Loads Outputs Directly Interface to CMOS, NMOS, and TTL Operating Voltage Range: 2 to 6 V Low Input Current: 1 A High Noise Immunity Characteristic of CMOS Devices In Compliance with the Requirements Defined by JEDEC Standard No. 7A * Chip Complexity 166 FETs or 41.5 Equivalent Gates
16
16 1
N SUFFIX PLASTIC PACKAGE CASE 648-08
16 1
D SUFFIX SOIC PACKAGE CASE 751B-05
16 1
DT SUFFIX TSSOP PACKAGE CASE 948F-01
ORDERING INFORMATION
LOGIC DIAGRAM
CLOCK 9 2 3 7 6 10 11 15 14 1 PIN 16 = VCC PIN 8 = GND Q0 Q0 Q1 Q1 Q2 Q2 Q3 Q3
MC54HCXXXAJ MC74HCXXXAN MC74HCXXXAD MC74HCXXXADT INVERTING AND NONINVERTING OUTPUTS
Ceramic Plastic SOIC TSSOP
D0 DATA INPUTS D1
4 5
PIN ASSIGNMENT
RESET Q0 Q0 D0 D1 Q1 Q1 GND 1 2 3 4 5 6 7 8 16 15 14 13 12 11 10 9 VCC Q3 Q3 D3 D2 Q2 Q2 CLOCK
D2 12 D3 13 RESET
FUNCTION TABLE
Inputs Reset L H H H
This document contains information on a product under development. Motorola reserves the right to change or discontinue this product without notice.
Outputs D X H L X Q Q L H H L L H No Change
Clock X
L
10/95
(c) Motorola, Inc. 1995
1
REV 0
IIIIIIIIIIIIIIIIIIIIIIIIIIIIIIIII I I II I I I IIIIIIIIIIIIIIIIIIIIIIIIIIIIIIIII I I II I I I III I I I I I I I IIIIIIIIIIIIIIIIIIIIIIIIIIIIIIIII I I II I I I IIIIIIIIIIIIIIIIIIIIIIIIIIIIIIIII I I II I I I IIIIIIIIIIIIIIIIIIIIIIIIIIIIIIIII I I II I I I IIIIIIIIIIIIIIIIIIIIIIIIIIIIIIIII IIIIIIIIIIIIIIIIIIIIIIIIIIIIIII I II I I I IIIIIIIIIIIIIIIIIIIIIIIIIIIIIIIII I I II I I I III I I I I I I I IIIIIIIIIIIIIIIIIIIIIIIIIIIIIIIII I I II I I I IIIIIIIIIIIIIIIIIIIIIIIIIIIIIIIII I I II I I I IIIIIIIIIIIIIIIIIIIIIIIIIIIIIIIII I I II I I I IIIIIIIIIIIIIIIIIIIIIIIIIIIIIIIII IIIIIIIIIIIIIIIIIIIIIIIIIIIIIII I II I I I IIIIIIIIIIIIIIIIIIIIIIIIIIIIIIIII I I II I I I III I I I I I I I IIIIIIIIIIIIIIIIIIIIIIIIIIIIIIIII I I II I I I IIIIIIIIIIIIIIIIIIIIIIIIIIIIIIIII I I II I I I IIIIIIIIIIIIIIIIIIIIIIIIIIIIIIIII I I II I I I IIIIIIIIIIIIIIIIIIIIIIIIIIIIIIIII IIIIIIIIIIIIIIIIIIIIIIIIIIIIIII I II I I I IIIIIIIIIIIIIIIIIIIIIIIIIIIIIIIII I I II I I I III I I I I I II I I I IIIIIIIIIIIIIIIIIIIIIIIIIIIIIIIII I I I IIIIIIIIIIIIIIIIIIIIIIIIIIIIIIIII I I II I I I III I I I I I I II I I I IIIIIIIIIIIIIIIIIIIIIIIIIIIIIIIII II I I IIIIIIIIIIIIIIIIIIIIIIIIIIIIIIIII I I IIIIIIIIIIIIIIIIIIIIIIIII II I I IIIIIIIIIIIIIIIIIIIIIIIIIIIIIIIII IIIIIIIIIIIIIIIIIIIIIIIIIIIIIII II I I IIIIIIIIIIIIIIIIIIIIIIIIIIIIIIIII I I II I II I I IIIIIIIIIIIIIIIIIIIIIIIIIIIIIIIII IIIIIII I I I I IIIIIIIIIIIIIIIIIIIIIIIIIIIIIIIII I I I IIIIIIIIIIIIIIIIIIIIIIIIIIIIIIIII I I III I I I IIIIIIIIIIIIIIIIIIIIIII I IIIIIIIIIIIIIIIIIIIIIII III I IIIIIIIIIIIIIIIIIIIIIII III I III I I I I IIIIIIIIIIIIIIIIIIIIIII I I IIIIIIIIIIIIIIIIIIIIIII III I III I I III I IIIIIIIIIIIIIIIIIIIIIII III I IIIIIIIIIIIIIIIIIIIIIII III I IIIIIIIIIIIIIIIIIIIIIII III I IIIIIIIIIIIIIIIIIIIIIII III I IIIIIIIIIIIIIIIIIIIIIII III I IIIIIIIIIIIIIIIIIIIIIII III I IIIIIIIIIIIIIIIIIIIIIII III I IIIIIIIIIIIIIIIIIIIIIII III I IIIIIIIIIIIIIIIIIIIIIII III I IIIIIIIIIIIIIIIIIIIIIII IIIIIIIIIIIIIIIIIIIII II I IIIIIIIIIIIIIIIIIIIIIII III I IIIIIIIIIIIIIIIIIIIIIII III I IIIIIIIIIIIIIIIIIIIIIII IIIIIIIIIIIIIIIIIIIII II I IIIIIIIIIIIIIIIIIIIIIII III I IIIIIIIIIIIIIIIIIIIIIII III I
* Maximum Ratings are those values beyond which damage to the device may occur. Functional operation should be restricted to the Recommended Operating Conditions. Derating -- Plastic DIP: - 10 mW/_C from 65_ to 125_C Ceramic DIP: - 10 mW/_C from 100_ to 125_C SOIC Package: - 7 mW/_C from 65_ to 125_C TSSOP Package: - 6.1 mW/_C from 65_ to 125_C For high frequency or heavy load considerations, see Chapter 2 of the Motorola High-Speed CMOS Data Book (DL129/D).
IIIIIIIIIIIIIIIIIIIIIII I I I IIIIIIIIIIIIIIIIIIIIIII I I I IIIIIIIIIIIIIIIIIIIIIII I I I III I I I IIIIIIIIIIIIIIIIIIIIIII I I I IIIIIIIIIIIIIIIIIIIIIII I I I IIIIIIIIIIIIIIIIIIIIIII I I I IIIIIIIIIIIIIIIIIIIIIII I I I IIIIIIIIIIIIIIIIIIIIIII I I I IIIIIIIIIIIIIIIIIIIIIII I I I IIIIIIIIIIIIIIIIIIIIIII I I I IIIIIIIIIIIIIIIIIIIIIII I I I IIIIIIIIIIIIIIIIIIIIIII I I I IIIIIIIIIIIIIIIIIIIIIII I I I IIIIIIIIIIIIIIIIIIIIIII I I I III I I I IIIIIIIIIIIIIIIIIIIIIII I I I IIIIIIIIIIIIIIIIIIIIIII I I I IIIIIIIIIIIIIIIIIIIIIII I I I IIIIIIIIIIIIIIIIIIIIIII I I I IIIIIIIIIIIIIIIIIIIIIII I I I IIIIIIIIIIIIIIIIIIIIIII I I I IIIIIIIIIIIIIIIIIIIIIII I I I IIIIIIIIIIIIIIIIIIIIIII I I I IIIIIIIIIIIIIIIIIIIIIII I I I IIIIIIIIIIIIIIIIIIIIIII I I I IIIIIIIIIIIIIIIIIIIIIII I I I IIIIIIIIIIIIIIIIIIIIIII I I I IIIIIIIIIIIIIIIIIIIIIII I I I IIIIIIIIIIIIIIIIIIIIIII I I I IIIIIIIIIIIIIIIIIIIIIII I I I IIIIIIIIIIIIIIIIIIIIIII I I I IIIIIIIIIIIIIIIIIIIIIII I I I IIIIIIIIIIIIIIIIIIIIIII I I I IIIIIIIIIIIIIIIIIIIIIII I I I IIIIIIIIIIIIIIIIIIIIIII I I I IIIIIIIIIIIIIIIIIIIIIII I I I IIIIIIIIIIIIIIIIIIIIIII IIIIIIIIIIIIIIIIIIIII I I IIIIIIIIIIIIIIIIIIIIIII I I I IIIIIIIIIIIIIIIIIIIIIII I IIIIIIII I I I IIIIIIIIIIIIIIIIIIIIIII IIIIIIIIIIIIIIIIIIIII IIIIIIIIIIIIIIII I IIIIIIIIIIIIIIIIIIIIIII IIIIIIIIIIIIIIIIIIIII I I IIIIIIIIIIIIIIIIIIIIIII III IIIIIIIIIIIIIIIIIIIIIII I I IIIIIIIIIIIIIIIIIIIIIII
MAXIMUM RATINGS*
MOTOROLA
DC ELECTRICAL CHARACTERISTICS (Voltages Referenced to GND)
RECOMMENDED OPERATING CONDITIONS
MC54/74HC175A
Symbol
Vin, Vout
Symbol
Symbol
VCC
Vout
Tstg
ICC
Iout
VCC
Vin
PD
TL
VOH
tr, tf
Iin
TA
VIH
VIL
Lead Temperature, 1 mm from Case for 10 Seconds (Plastic DIP, SOIC or TSSOP Package) (Ceramic DIP)
Storage Temperature
Power Dissipation in Still Air, Plastic or Ceramic DIP SOIC Package TSSOP Package
DC Supply Current, VCC and GND Pins
DC Output Current, per Pin
DC Input Current, per Pin
DC Output Voltage (Referenced to GND)
DC Input Voltage (Referenced to GND)
DC Supply Voltage (Referenced to GND)
Input Rise and Fall Time (Figure 1)
Operating Temperature, All Package Types
DC Input Voltage, Output Voltage (Referenced to GND)
DC Supply Voltage (Referenced to GND)
Minimum High-Level Output Voltage
Maximum Low-Level Input Voltage
Minimum High-Level Input Voltage
Parameter
Parameter
Parameter
Vin = VIH or VIL |Iout| 20 A
Vin = VIH or VIL |Iout| |Iout| |Iout|
Vout = 0.1 V or VCC - 0.1 V |Iout| 20 A
Vout = 0.1 V or VCC - 0.1 V |Iout| 20 A
v
v
v
VCC = 2.0 V VCC = 3.0 V VCC = 4.5 V VCC = 6.0 V
Test Conditions
- 0.5 to VCC + 0.5
- 1.5 to VCC + 1.5
- 65 to + 150
- 0.5 to + 7.0
2 - 55 Min 2.0 Value
v 2.4 mA v 4.0 mA v 5.2 mA
0 0 0
0
50
25
20
260 300
750 500 450
+ 125
1000 600 500 400
VCC
Max
6.0
VCC V
3.0 4.5 6.0
2.0 4.5 6.0
2.0 3.0 4.5 6.0
2.0 3.0 4.5 6.0
Unit
Unit
mW
mA
mA
mA
_C
_C
_C
ns
V
V
V
V
V
- 55 to 25_C
0.5 0.9 1.35 1.80
1.5 2.1 3.15 4.2
2.48 3.98 5.48
1.9 4.4 5.9
This device contains protection circuitry to guard against damage due to high static voltages or electric fields. However, precautions must be taken to avoid applications of any voltage higher than maximum rated voltages to this high-impedance circuit. For proper operation, Vin and Vout should be constrained to the range GND (Vin or Vout) VCC. Unused inputs must always be tied to an appropriate logic voltage level (e.g., either GND or VCC). Unused outputs must be left open.
Guaranteed Limit
v 85_C v 125_C
High-Speed CMOS Logic Data DL129 -- Rev 6 0.5 0.9 1.35 1.80 1.5 2.1 3.15 4.2 2.34 3.84 5.34 1.9 4.4 5.9
v
0.5 0.9 1.35 1.80
1.5 2.1 3.15 42
2.20 3.70 5.20 1.9 4.4 5.9
v
Unit
V V V
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NOTES: 1. For propagation delays with loads other than 50 pF, see Chapter 2 of the Motorola High-Speed CMOS Data Book (DL129/D). 2. Information on typical parametric values can be found in Chapter 2 of the Motorola High-Speed CMOS Data Book (DL129/D). NOTE: Information on typical parametric values can be found in Chapter 2 of the Motorola High-Speed CMOS Data Book (DL129/D).
High-Speed CMOS Logic Data DL129 -- Rev 6 Symbol Symbol tPLH, tPHL tTLH, tTHL VOL tPHL fmax CPD ICC Cin Iin Maximum Quiescent Supply Current (per Package) Maximum Input Leakage Current Maximum Low-Level Output Voltage Power Dissipation Capacitance (Per Flip-Flop)* Maximum Input Capacitance Maximum Output Transition Time, Any Output (Figures 1 and 4) Maximum Propagation Delay, Reset to Q or Q (Figures 2 and 4) Maximum Propagation Delay, Clock to Q or Q (Figures 1 and 4) Maximum Clock Frequency (50% Duty Cycle) (Figures 1 and 4) Parameter Parameter Vin = VIH or VIL |Iout| 20 A Vin = VCC or GND Iout = 0 A Vin = VCC or GND
* Used to determine the no-load dynamic power consumption: PD = CPD VCC 2 f + ICC VCC . For load considerations, see Chapter 2 of the Motorola High-Speed CMOS Data Book (DL129/D).
AC ELECTRICAL CHARACTERISTICS (CL = 50 pF, Input tr = tf = 6 ns)
DC ELECTRICAL CHARACTERISTICS (Voltages Referenced to GND)
Vin = VIH or VIL |Iout| |Iout| |Iout|
v
Test Conditions
3
v 2.4 mA v 4.0 mA v 5.2 mA
VCC V
VCC V
2.0 3.0 4.5 6.0
2.0 3.0 4.5 6.0
2.0 3.0 4.5 6.0
2.0 3.0 4.5 6.0
6.0
6.0
3.0 4.5 6.0
2.0 4.5 6.0
--
- 55 to 25_C
- 55 to 25_C
Typical @ 25C, VCC = 5.0 V
0.1
0.26 0.26 0.26
110 36 22 19
0.1 0.1 0.1
10
75 27 15 13
90 40 19 16
10 15 30 50
4
Guaranteed Limit
Guaranteed Limit
v 85_C v 125_C
v 85_C v 125_C
1.0
0.33 0.33 0.33
220 55 22 19
125 45 26 23
0.1 0.1 0.1
9 14 28 45
10
95 32 19 16
40
35
MC54/74HC175A
1.0
0.40 0.40 0.40
130 70 30 25
160 60 32 28
160
110 36 22 19
0.1 0.1 0.1
8 12 25 40
10
MOTOROLA MHz Unit Unit A A pF pF ns ns ns V
IIIIIIIIIIIIIIIIIIIIIIIIIIIIIIIII I I II I I IIIIIIIIIIIIIIIIIIIIIIIIIIIIIIIII I I II I I III I I I I I I IIIIIIIIIIIIIIIIIIIIIIIIIIIIIIIII I I II I I IIIIIIIIIIIIIIIIIIIIIIIIIIIIIIIII I I II I I IIIIIIIIIIIIIIIIIIIIIIIIIIIIIIIII I I II I I IIIIIIIIIIIIIIIIIIIIIIIIIIIIIIIII IIIIIIIIIIIIIIIIIIIIIIIIIIIIIII I II I I IIIIIIIIIIIIIIIIIIIIIIIIIIIIIIIII I I II I I III I I I I I I IIIIIIIIIIIIIIIIIIIIIIIIIIIIIIIII I I II I I IIIIIIIIIIIIIIIIIIIIIIIIIIIIIIIII I I II I I IIIIIIIIIIIIIIIIIIIIIIIIIIIIIIIII I I II I I IIIIIIIIIIIIIIIIIIIIIIIIIIIIIIIII IIIIIIIIIIIIIIIIIIIIIIIIIIIIIII I II I I IIIIIIIIIIIIIIIIIIIIIIIIIIIIIIIII I I II I I III I I I I I I IIIIIIIIIIIIIIIIIIIIIIIIIIIIIIIII I I II I I IIIIIIIIIIIIIIIIIIIIIIIIIIIIIIIII I I II I I IIIIIIIIIIIIIIIIIIIIIIIIIIIIIIIII I I II I I IIIIIIIIIIIIIIIIIIIIIIIIIIIIIIIII IIIIIIIIIIIIIIIIIIIIIIIIIIIIIII I II I I IIIIIIIIIIIIIIIIIIIIIIIIIIIIIIIII I I II I I III I I I I I I IIIIIIIIIIIIIIIIIIIIIIIIIIIIIIIII I I II I I IIIIIIIIIIIIIIIIIIIIIIIIIIIIIIIII I I II I I IIIIIIIIIIIIIIIIIIIIIIIIIIIIIIIII I I II I I IIIIIIIIIIIIIIIIIIIIIIIIIIIIIIIII IIIIIIIIIIIIIIIIIIIIIIIIIIIIIII I II I I IIIIIIIIIIIIIIIIIIIIIIIIIIIIIIIII I I II I I III I I I I I I IIIIIIIIIIIIIIIIIIIIIIIIIIIIIIIII I I II I I IIIIIIIIIIIIIIIIIIIIIIIIIIIIIIIII I I II I I IIIIIIIIIIIIIIIIIIIIIIIIIIIIIIIII I I II I I IIIIIIIIIIIIIIIIIIIIIIIIIIIIIIIII IIIIIIIIIIIIIIIIIIIIIIIIIIIIIII I II I I IIIIIIIIIIIIIIIIIIIIIIIIIIIIIIIII I I II I I III I I I I I I IIIIIIIIIIIIIIIIIIIIIIIIIIIIIIIII I I II I I IIIIIIIIIIIIIIIIIIIIIIIIIIIIIIIII I I II I I IIIIIIIIIIIIIIIIIIIIIIIIIIIIIIIII I I II I I IIIIIIIIIIIIIIIIIIIIIIIIIIIIIIIII I I II I I IIIIIIIIIIIIIIIIIIIIIIIIIIIIIIIII I I II I I IIIIIIIIIIIIIIIIIIIIIIIIIIIIIIIII I I II I I IIIIIIIIIIIIIIIIIIIIIIIIIIIIIIIII I I II I II I IIIIIIIIIIIIIIIIIIIIIIIIIIIIIIIII I I IIIIIIIIIIIIIIIIIIIIIIIIIIIIIIIII IIIIIIIIIIIIIIIIIIIIIIIIIIIIIII II I IIIIIIIIIIIIIIIIIIIIIIIIIIIIIIIII I II I IIIIIIIIIIIIIIIIIIIIIIIIIIIIIIIII I II I
NOTE: Information on typical parametric values can be found in Chapter 2 of the Motorola High-Speed CMOS Data Book (DL129/D).
MOTOROLA
TIMING REQUIREMENTS (Input tr = tf = 6 ns)
MC54/74HC175A
Symbol
trec
tr, tf
tsu
tw
tw
th
Maximum Input Rise and Fall Times (Figure 1)
Minimum Pulse Width, Reset (Figure 2)
Minimum Pulse Width, Clock (Figure 1)
Minimum Recovery Time, Reset Inactive to Clock (Figure 2)
Minimum Hold Time, Clock to Data (Figure 3)
Minimum Setup Time, Data to Clock (Figure 3)
Parameter
4 VCC V 2.0 3.0 4.5 6.0 2.0 3.0 4.5 6.0 2.0 3.0 4.5 6.0 2.0 3.0 4.5 6.0 2.0 3.0 4.5 6.0 2.0 3.0 4.5 6.0 - 55 to 25_C 1000 800 500 400 75 27 15 13 75 27 15 13 75 30 15 13 75 30 15 13 1 1 1 1
Guaranteed Limit
v 85_C v 125_C
High-Speed CMOS Logic Data DL129 -- Rev 6 1000 800 500 400 95 32 19 16 95 32 19 16 95 40 19 16 95 40 19 16 1 1 1 1 1000 800 500 400 110 36 22 19 110 36 22 19 110 55 22 19 110 55 22 19 1 1 1 1 Unit ns ns ns ns ns ns
MC54/74HC175A
SWITCHING WAVEFORMS
tw RESET tf CLOCK 90% 50% 10% tw 1/fmax 90% 50% 10% tPLH tPHL CLOCK tTLH tTHL tr VCC GND Q 50% tPHL 50% tPLH Q 50% trec VCC 50% GND VCC GND
Q or Q
Figure 1.
Figure 2.
VALID VCC DATA tsu CLOCK GND th VCC 50% GND
Figure 3.
TEST CIRCUIT
TEST POINT OUTPUT DEVICE UNDER TEST
CL*
* Includes all probe and jig capacitance
Figure 4.
High-Speed CMOS Logic Data DL129 -- Rev 6
5
MOTOROLA
MC54/74HC175A
EXPANDED LOGIC DIAGRAM
4 2
D0
D C
Q
Q0
CLOCK
9
C
3 R
Q0
D1
5
D C C
Q
7
Q1
6 R
Q1
D2
12
D C C
Q
10
Q2
11 R
Q2
D3
13
D C C
Q
15
Q3
14 R
Q3
RESET
1
MOTOROLA
6
High-Speed CMOS Logic Data DL129 -- Rev 6
MC54/74HC175A
OUTLINE DIMENSIONS
-A -
16 9
J SUFFIX CERAMIC PACKAGE CASE 620-10 ISSUE V
-B - C L
1
8
NOTES: 1. DIMENSIONING AND TOLERANCING PER ANSI Y14.5M, 1982. 2. CONTROLLING DIMENSION: INCH. 3. DIMENSION L TO CENTER OF LEAD WHEN FORMED PARALLEL. 4. DIM F MAY NARROW TO 0.76 (0.030) WHERE THE LEAD ENTERS THE CERAMIC BODY. INCHES MIN MAX 0.750 0.785 0.240 0.295 -- 0.200 0.015 0.020 0.050 BSC 0.055 0.065 0.100 BSC 0.008 0.015 0.125 0.170 0.300 BSC 15 0 0.020 0.040 MILLIMETERS MIN MAX 19.05 19.93 6.10 7.49 -- 5.08 0.39 0.50 1.27 BSC 1.40 1.65 2.54 BSC 0.21 0.38 3.18 4.31 7.62 BSC 15 0 1.01 0.51
-T
SEATING - PLANE
N E F G D 16 PL 0.25 (0.010)
M
K M J 16 PL 0.25 (0.010)
M
TB
S
TA
S
DIM A B C D E F G J K L M N
-A -
16 9
N SUFFIX PLASTIC PACKAGE CASE 648-08 ISSUE R
B
1
8
NOTES: 1. DIMENSIONING AND TOLERANCING PER ANSI Y14.5M, 1982. 2. CONTROLLING DIMENSION: INCH. 3. DIMENSION L TO CENTER OF LEADS WHEN FORMED PARALLEL. 4. DIMENSION B DOES NOT INCLUDE MOLD FLASH. 5. ROUNDED CORNERS OPTIONAL. DIM A B C D F G H J K L M S INCHES MILLIMETERS MIN MAX MIN MAX 0.740 0.770 18.80 19.55 6.35 0.250 0.270 6.85 3.69 0.145 0.175 4.44 0.39 0.015 0.021 0.53 1.02 0.040 0.070 1.77 0.100 BSC 2.54 BSC 0.050 BSC 1.27 BSC 0.21 0.008 0.015 0.38 2.80 0.110 0.130 3.30 7.50 0.295 0.305 7.74 0 0 10 10 0.020 0.040 0.51 1.01
F S
C
L
-T - H G D 16 PL 0.25 (0.010)
M
SEATING PLANE
K
J TA
M
M
-A -
16 9
D SUFFIX PLASTIC SOIC PACKAGE CASE 751B-05 ISSUE J
-B -
1 8
P 8 PL 0.25 (0.010)
M
B
M
G F
NOTES: 1. DIMENSIONING AND TOLERANCING PER ANSI Y14.5M, 1982. 2. CONTROLLING DIMENSION: MILLIMETER. 3. DIMENSIONS A AND B DO NOT INCLUDE MOLD PROTRUSION. 4. MAXIMUM MOLD PROTRUSION 0.15 (0.006) PER SIDE. 5. DIMENSION D DOES NOT INCLUDE DAMBAR PROTRUSION. ALLOWABLE DAMBAR PROTRUSION SHALL BE 0.127 (0.005) TOTAL IN EXCESS OF THE D DIMENSION AT MAXIMUM MATERIAL CONDITION. DIM A B C D F G J K M P R MILLIMETERS MIN MAX 9.80 10.00 3.80 4.00 1.35 1.75 0.35 0.49 0.40 1.25 1.27 BSC 0.19 0.25 0.10 0.25 0 7 5.80 6.20 0.25 0.50 INCHES MIN MAX 0.386 0.393 0.150 0.157 0.054 0.068 0.014 0.019 0.016 0.049 0.050 BSC 0.008 0.009 0.004 0.009 0 7 0.229 0.244 0.010 0.019
K C -T SEATING -
PLANE
R X 45
M D 16 PL 0.25 (0.010)
M
J
T
B
S
A
S
High-Speed CMOS Logic Data DL129 -- Rev 6
7
MOTOROLA
MC54/74HC175A
OUTLINE DIMENSIONS
DT SUFFIX PLASTIC TSSOP PACKAGE CASE 948F-01 ISSUE O
16X K REF
0.10 (0.004) 0.15 (0.006) T U
S
M
TU
S
V
S
K
K1
2X
L/2
16
9
J1 B -U-
L
PIN 1 IDENT. 1 8
SECTION N-N J
N 0.25 (0.010) 0.15 (0.006) T U
S
A -V- N F DETAIL E
NOTES: 1. DIMENSIONING AND TOLERANCING PER ANSI Y14.5M, 1982. 2. CONTROLLING DIMENSION: MILLIMETER. 3. DIMENSION A DOES NOT INCLUDE MOLD FLASH. PROTRUSIONS OR GATE BURRS. MOLD FLASH OR GATE BURRS SHALL NOT EXCEED 0.15 (0.006) PER SIDE. 4. DIMENSION B DOES NOT INCLUDE INTERLEAD FLASH OR PROTRUSION. INTERLEAD FLASH OR PROTRUSION SHALL NOT EXCEED 0.25 (0.010) PER SIDE. 5. DIMENSION K DOES NOT INCLUDE DAMBAR PROTRUSION. ALLOWABLE DAMBAR PROTRUSION SHALL BE 0.08 (0.003) TOTAL IN EXCESS OF THE K DIMENSION AT MAXIMUM MATERIAL CONDITION. 6. TERMINAL NUMBERS ARE SHOWN FOR REFERENCE ONLY. 7. DIMENSION A AND B ARE TO BE DETERMINED AT DATUM PLANE -W-. MILLIMETERS MIN MAX 4.90 5.10 4.30 4.50 --- 1.20 0.05 0.15 0.50 0.75 0.65 BSC 0.18 0.28 0.09 0.20 0.09 0.16 0.19 0.30 0.19 0.25 6.40 BSC 0_ 8_ INCHES MIN MAX 0.193 0.200 0.169 0.177 --- 0.047 0.002 0.006 0.020 0.030 0.026 BSC 0.007 0.011 0.004 0.008 0.004 0.006 0.007 0.012 0.007 0.010 0.252 BSC 0_ 8_
M
DIM A B C D F G H J J1 K K1 L M
C 0.10 (0.004) -T- SEATING
PLANE
H D G
DETAIL E
Motorola reserves the right to make changes without further notice to any products herein. Motorola makes no warranty, representation or guarantee regarding the suitability of its products for any particular purpose, nor does Motorola assume any liability arising out of the application or use of any product or circuit, and specifically disclaims any and all liability, including without limitation consequential or incidental damages. "Typical" parameters can and do vary in different applications. All operating parameters, including "Typicals" must be validated for each customer application by customer's technical experts. Motorola does not convey any license under its patent rights nor the rights of others. Motorola products are not designed, intended, or authorized for use as components in systems intended for surgical implant into the body, or other applications intended to support or sustain life, or for any other application in which the failure of the Motorola product could create a situation where personal injury or death may occur. Should Buyer purchase or use Motorola products for any such unintended or unauthorized application, Buyer shall indemnify and hold Motorola and its officers, employees, subsidiaries, affiliates, and distributors harmless against all claims, costs, damages, and expenses, and reasonable attorney fees arising out of, directly or indirectly, any claim of personal injury or death associated with such unintended or unauthorized use, even if such claim alleges that Motorola was negligent regarding the design or manufacture of the part. Motorola and are registered trademarks of Motorola, Inc. Motorola, Inc. is an Equal Opportunity/Affirmative Action Employer.
How to reach us: USA/EUROPE: Motorola Literature Distribution; P.O. Box 20912; Phoenix, Arizona 85036. 1-800-441-2447 MFAX: RMFAX0@email.sps.mot.com -TOUCHTONE (602) 244-6609 INTERNET: http://Design-NET.com
JAPAN: Nippon Motorola Ltd.; Tatsumi-SPD-JLDC, Toshikatsu Otsuki, 6F Seibu-Butsuryu-Center, 3-14-2 Tatsumi Koto-Ku, Tokyo 135, Japan. 03-3521-8315 HONG KONG: Motorola Semiconductors H.K. Ltd.; 8B Tai Ping Industrial Park, 51 Ting Kok Road, Tai Po, N.T., Hong Kong. 852-26629298
MOTOROLA
CODELINE
8
*MC54/74HC175A/D*
EE CC EE CC EE CC EE CC
-W-
MC54/74HC175A/D High-Speed CMOS Logic Data DL129 -- Rev 6


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